BGA Rework Knowledge
bga rework knowledge / Reballing bga
During PCB assembly and manufacturing, Ball Grid Arrays (BGAs) may need to be re-balled, from time to time. Sometimes a BGA may get damaged or a cold solder or bridge is created, which require depopulating the BGA for BGA Rework. The EMS provider should have certain capabilities and experience to deal with this issue. Those capabilities involve printed circuit board materials, BGA placement systems, and specific BGA rework systems.
BGA can be damaged by excessive heat being applied as a result of using wrong thermal profile at the re-flow ovens in the manufacturing stages. The key to install a clean BGA is to make sure that the PCB surface is flat and clean, using the right thermal profile and proper BGA placement system and verifying this placement by using a high powered X-ray machine.
To summarize, it is important to assure that pin-configurable BGAs should be partitioned properly using the correct ground and power pins outs. These BGAs should also be routed with utmost care to make sure that decoupling is properly implemented, and noise has been suppressed. At the manufacturing level, each BGA should be properly mounted with a precise vision placement system and then its connections verified by powerful X-ray equipment.
For further information on Ball Grid Arrays (BGAs) Assembly. Please Contact us for free consultation by calling 847-439-5447 or by sending an email.
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