Lead Free Surface Finishes
quicklinks
lead free surface finishes
The surface finish forms a critical interface between the component and the PCB. The finish has two essential functions, to protect the exposed copper circuitry and to provide a solderable surface when assembling (soldering) the components to the printed circuit board.
lead free surface finishes chart
| Item | Description |
|---|---|
| Gold Finish | May be Electrolytic Electroless, or Immersion |
| ENIG (Electroless Nickel Immersion Gold) | 2-5 micro inches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface, and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical. |
| Hard Gold | Purpose: Used for Gold Fingers (minimum 30 micro inches), soldering (maximum 17 micro inches), to prevent oxidation and extend shelf life. |
| Soft Gold | Purpose: Used for wire bonding (Ultrasonic minimum 2 micro inches/Thermasonic minimum 12 micro inches) and to prevent oxidation and extend shelf life. |
| Immersion Silver | Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is critical. |
| Lead Free Solder | Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is not critical. |
| OSP (Organic Solderability Preservatives) | Used for solderability when the flatness of the pad is critical. |
| White Tin (Immersion Tin) | sed for solderability when the flatness of the pad is critical. |
get started now
888-228-9440
For a Quick-Turn on Affordable PCB Fabrication & Assembly
